CH12864-37- L
Product Description
1.1 COG process, FPC flexible ribbon cable as solder interface, product with backlight, assembled, thin thickness, stable structure.
1.2IC uses ST7567, and there is no font library inside the chip. Programmers create their own font library.
1.3 Low power consumption, 3.3V power mode, no backlight current within 1mA, with backlight current within 60mA.
1.4LED backlight A and K are PCB boards, and A and K require separate power supply of 2.9V~3.0V.
1.5 Product Features:
The built-in display data RAM is 64x128 bits.
The external capacitor generates a boost.
The contrast is adjusted by software to adjust depth and depth.
One screen displays 8 characters x 4 lines (16x16 dot matrix).
Single image ≤ 128x64 dot matrix.
8-bit parallel port or 4-wire SPI interface communication.
Rich features: The interface displays on/off, forward/reverse.
1.2IC uses ST7567, and there is no font library inside the chip. Programmers create their own font library.
1.3 Low power consumption, 3.3V power mode, no backlight current within 1mA, with backlight current within 60mA.
1.4LED backlight A and K are PCB boards, and A and K require separate power supply of 2.9V~3.0V.
1.5 Product Features:
The built-in display data RAM is 64x128 bits.
The external capacitor generates a boost.
The contrast is adjusted by software to adjust depth and depth.
One screen displays 8 characters x 4 lines (16x16 dot matrix).
Single image ≤ 128x64 dot matrix.
8-bit parallel port or 4-wire SPI interface communication.
Rich features: The interface displays on/off, forward/reverse.
